finite element modeling and simulation with ansys workbench

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Finite Element Modeling And Simulation With Ansys Workbench

Author : Xiaolin Chen
ISBN : 9781439873847
Genre : Science
File Size : 33. 72 MB
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Learn Basic Theory and Software Usage from a Single Volume Finite Element Modeling and Simulation with ANSYS Workbench combines finite element theory with real-world practice. Providing an introduction to finite element modeling and analysis for those with no prior experience, and written by authors with a combined experience of 30 years teaching the subject, this text presents FEM formulations integrated with relevant hands-on applications using ANSYS Workbench for finite element analysis (FEA). Incorporating the basic theories of FEA and the use of ANSYS Workbench in the modeling and simulation of engineering problems, the book also establishes the FEM method as a powerful numerical tool in engineering design and analysis. Include FEA in Your Design and Analysis of Structures Using ANSYS Workbench The authors reveal the basic concepts in FEA using simple mechanics problems as examples, and provide a clear understanding of FEA principles, element behaviors, and solution procedures. They emphasize correct usage of FEA software, and techniques in FEA modeling and simulation. The material in the book discusses one-dimensional bar and beam elements, two-dimensional plane stress and plane strain elements, plate and shell elements, and three-dimensional solid elements in the analyses of structural stresses, vibrations and dynamics, thermal responses, fluid flows, optimizations, and failures. Contained in 12 chapters, the text introduces ANSYS Workbench through detailed examples and hands-on case studies, and includes homework problems and projects using ANSYS Workbench software that are provided at the end of each chapter. Covers solid mechanics and thermal/fluid FEA Contains ANSYS Workbench geometry input files for examples and case studies Includes two chapters devoted to modeling and solution techniques, design optimization, fatigue, and buckling failure analysis Provides modeling tips in case studies to provide readers an immediate opportunity to apply the skills they learn in a problem-solving context Finite Element Modeling and Simulation with ANSYS Workbench benefits upper-level undergraduate students in all engineering disciplines, as well as researchers and practicing engineers who use the finite element method to analyze structures.

Finite Element Modeling And Simulation With Ansys Workbench Second Edition

Author : Taylor & Francis Group
ISBN : 1138486299
Genre :
File Size : 87. 95 MB
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Finite Element Simulations With Ansys Workbench 18

Author : Huei-Huang Lee
ISBN : 9781630571733
Genre : Computers
File Size : 47. 20 MB
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Finite Element Simulations with ANSYS Workbench 18 is a comprehensive and easy to understand workbook. Printed in full color, it utilizes rich graphics and step-by-step instructions to guide you through learning how to perform finite element simulations using ANSYS Workbench. Twenty seven real world case studies are used throughout the book. Many of these case studies are industrial or research projects that you build from scratch. Prebuilt project files are available for download should you run into any problems. Companion videos, that demonstrate exactly how to perform each tutorial, are also available. Relevant background knowledge is reviewed whenever necessary. To be efficient, the review is conceptual rather than mathematical. Key concepts are inserted whenever appropriate and summarized at the end of each chapter. Additional exercises or extension research problems are provided as homework at the end of each chapter. A learning approach emphasizing hands-on experiences is utilized though this entire book. A typical chapter consists of six sections. The first two provide two step-by-step examples. The third section tries to complement the exercises by providing a more systematic view of the chapter subject. The following two sections provide more exercises. The final section provides review problems.

Ansys Workbench Software Tutorial With Multimedia Cd

Author : Fereydoon Dadkhah
ISBN : 9781585035816
Genre : Computers
File Size : 50. 50 MB
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ANSYS Workbench Release 12 Software Tutorial with MultiMedia CD is directed toward using finite element analysis to solve engineering problems. Unlike most textbooks which focus solely on teaching the theory of finite element analysis or tutorials that only illustrate the steps that must be followed to operate a finite element program, ANSYS Workbench Software Tutorial with MultiMedia CD integrates both. This textbook and CD are aimed at the student or practitioner who wishes to begin making use of this powerful software tool. The primary purpose of this tutorial is to introduce new users to the ANSYS Workbench software, by illustrating how it can be used to solve a variety of problems. To help new users begin to understand how good finite element models are built, this tutorial takes the approach that FEA results should always be compared with other data results. In several chapters, the finite element tutorial problem is compared with manual calculations so that the reader can compare and contrast the finite element results with the manual solution. Most of the examples and some of the exercises make reference to existing analytical solutions In addition to the step-by-step tutorials, introductory material is provided that covers the capabilities and limitations of the different element and solution types. The majority of topics and examples presented are oriented to stress analysis, with the exception of natural frequency analysis in chapter 11, and heat transfer in chapter 12.

Ansys Workbench Tutorial Release 13

Author : Kent L. Lawrence
ISBN : 9781585036714
Genre : Computers
File Size : 43. 77 MB
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The exercises in ANSYS Workbench Tutorial Release 13 introduce the reader to effective engineering problem solving through the use of this powerful modeling, simulation and optimization tool. Topics that are covered include solid modeling, stress analysis, conduction/convection heat transfer, thermal stress, vibration and buckling. It is designed for practicing and student engineers alike and is suitable for use with an organized course of instruction or for self-study.

Finite Element Modeling Fem Of Porous Additively Manufactured Ferromagnetic Shape Memory Alloy Using Scanning Electron Micrograph Sem Based Geometries

Author : Eric J. Myers
ISBN : OCLC:1006509351
Genre : Ferromagnetic materials
File Size : 20. 37 MB
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The purpose of this research is develop an accurate modeling technique, using ANSYS software, to simulate the magneto-mechanical behavior of functional parts additively manufactured (AM) from Ni-Mn-Ga ferromagnetic shape memory alloy (FSMA) powders. Since bulk (100% dense material) Ni-Mn-Ga alloys are brittle, it is difficult to manufacture complex shaped parts from this material using typical machining methods. The technological interest in Ni-Mn-Ga resides on the large recoverable magnetic field induced strain (up to 10% in Ni-Mn-Ga single crystals). However, in the case of bulk polycrystalline Ni-Mn-Ga the magnetic field induced strain (MFIS) is much smaller, about 0.5%. Larger MFIS, up to 8%, was reported in Ni-Mn-Ga foam-like materials. In order to address the combined requirements of producing complex-shaped porous parts having high MFIS, binder jetting 3D printing has used to produce Ni-Mn-Ga parts showing reversible martensitic transformation. Compressive testing showed that AM parts do not share the mechanical properties of the bulk material. Their porosity makes the parts similar to a structure, so stress and strain distribution throughout the body is not uniform and theoretical stress and strain equations cannot be used. In addition, porosity weakens the parts due to the introduction of stress risers at the edges where particles are sintered together. To create a geometry that accurately captures the porous microstructure of a 3D printed Ni-Mn-Ga part, an initial micrograph of a polished cross-section of the part was recorded using a scanning electron microscope (SEM). Using Adobe Photoshop, the SEM micrograph was converted into a binary image to increase the contrast between the voids and the material. Thus, the border could be traced with polylines and converted into Drawing Exchange Format (DXF). This CAD data file format was then imported into AutoCAD software, converted into a surface body, and imported into ANSYS Workbench software for modelling. Using FEA modeling it was possible to monitor the stress risers and to determine the fracture strain of the part. It was determined that at moderate stress-strain values the model can predict the mechanical behavior of the printed part. This thesis defense presentation will report on the current status of ANSYS simulation of mechanical behavior of porous Ni-Mn-Ga parts made by AM, and its feasibility as a useable modeling technique for porous functional parts made of shape memory alloys.

Power Electronic Packaging

Author : Yong Liu
ISBN : 9781461410539
Genre : Technology & Engineering
File Size : 45. 79 MB
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Design News

Author :
ISBN : UCSD:31822036052504
Genre : Engineering design
File Size : 72. 44 MB
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Scientific Computing In Electrical Engineering

Author : G. Ciuprina
ISBN : 9783540719809
Genre : Computers
File Size : 30. 66 MB
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This book is a collection of selected papers presented at the last Scientific Computing in Electrical Engineering (SCEE) Conference, held in Sinaia, Romania, in 2006. The series of SCEE conferences aims at addressing mathematical problems which have a relevance to industry, with an emphasis on modeling and numerical simulation of electronic circuits, electromagnetic fields but also coupled problems and general mathematical and computational methods.

Ieee Aiaa Digital Avionics Systems Conference

Author : IEEE Aerospace and Electronic Systems Society
ISBN : UOM:39015058740831
Genre : Avionics
File Size : 44. 33 MB
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