materials for electronic packaging

Download Book Materials For Electronic Packaging in PDF format. You can Read Online Materials For Electronic Packaging here in PDF, EPUB, Mobi or Docx formats.

Electronic Packaging Materials And Their Properties

Author : Michael Pecht
ISBN : 9781351830041
Genre : Technology & Engineering
File Size : 88. 61 MB
Format : PDF, ePub
Download : 708
Read : 270

Get This Book


Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Materials For Electronic Packaging

Author : Deborah D.L. Chung
ISBN : 0080511171
Genre : Technology & Engineering
File Size : 57. 8 MB
Format : PDF, Kindle
Download : 994
Read : 784

Get This Book


Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Electronic Packaging And Interconnection Handbook 4 E

Author : Charles Harper
ISBN : 0071430482
Genre : Technology & Engineering
File Size : 55. 13 MB
Format : PDF, ePub, Mobi
Download : 143
Read : 394

Get This Book


Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Materials For High Density Electronic Packaging And Interconnection

Author : Commission on Engineering and Technical Systems
ISBN : 9780309042338
Genre : Technology & Engineering
File Size : 25. 78 MB
Format : PDF, ePub
Download : 999
Read : 802

Get This Book



Power Electronic Packaging

Author : Yong Liu
ISBN : 9781461410539
Genre : Technology & Engineering
File Size : 69. 93 MB
Format : PDF, Docs
Download : 315
Read : 681

Get This Book


Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Electronic Packaging

Author : John H. Lau
ISBN : 0070371350
Genre : Technology & Engineering
File Size : 78. 2 MB
Format : PDF, ePub, Mobi
Download : 814
Read : 1267

Get This Book


Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Advanced Materials For Thermal Management Of Electronic Packaging

Author : Xingcun Colin Tong Ph.D
ISBN : 1441977597
Genre : Technology & Engineering
File Size : 77. 91 MB
Format : PDF, ePub
Download : 514
Read : 405

Get This Book


The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Materials For Advanced Packaging

Author : Daniel Lu
ISBN : 9783319450988
Genre : Technology & Engineering
File Size : 45. 51 MB
Format : PDF, ePub, Docs
Download : 563
Read : 491

Get This Book


Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Semiconductor Packaging

Author : Andrea Chen
ISBN : 9781439862070
Genre : Technology & Engineering
File Size : 60. 22 MB
Format : PDF
Download : 169
Read : 776

Get This Book


In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Advanced Materials For Thermal Management Of Electronic Packaging

Author : Xingcun Colin Tong Ph.D
ISBN : 1441977597
Genre : Technology & Engineering
File Size : 77. 55 MB
Format : PDF, ePub, Docs
Download : 250
Read : 928

Get This Book


The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Top Download:

Best Books