molecular adhesion and its applications the sticky universe

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Molecular Adhesion And Its Applications

Author : Kevin Kendall
ISBN : 9780306484063
Genre : Science
File Size : 26. 8 MB
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At the beginning of the twentieth century, engineers and technologists would have recognized the importance of adhesion in two main aspects: First, in the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and certain pastes, they regarded them as materials of uncertain formulation, too impure to be amenable to precise experiment. Biological scientists were aware also of adhesive phenomena, but the science was supported by documentation rather than understanding. By the end of the century, adhesion and adhesives were playing a crucial and deliberate role in the formulation of materials, in the design and manufacture of engineering structures without weakening rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical scientists were aware that the states of matter, whether gas, liquid, or solid, were determined by the competition between thermal energy and int- molecular binding forces. Then the solid state had to be differentiated into crystals, amorphous glasses, metals, etc. , so the importance of the molecular attractions in determining stiffness and strength became clearer.


Author : James E. Morris
ISBN : 9780387473260
Genre : Technology & Engineering
File Size : 85. 40 MB
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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

An Introduction To Interfaces Colloids

Author : John C. Berg
ISBN : 9789814293075
Genre : Science
File Size : 45. 93 MB
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Offers an introduction to the topics in interfacial phenomena, colloid science or nanoscience. Designed as a pedagogical tool, this book recognizes the cross-disciplinary nature of the subject. It features descriptions of experiments and contains figures and illustrations that enhance the understanding of concepts.

Adhesion Science

Author : Steven Abbott
ISBN : 9781605951782
Genre : Science
File Size : 37. 77 MB
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Explains the physics and chemistry of adhesion, surface preparation and testsPresents new strategies for formulating superior strong, weak and pressure-sensitive adhesivesIncludes access to unique electronic apps that enable numerical modeling of adhesives This technical bound book explains the basic principles of adhesion and shows how they are used to formulate and improve adhesives. The volume starts by laying out key physical and chemical concepts underlying adhesion and adhesives, including strong and weak bonds plus pressure-sensitive (PSA) across multiple polymer, metal and ceramic adherends. The ideas are expressed in clear and easily understood mathematical formulas that explain surface properties as well as "good" and "bad" adhesion, with the latter covering multiple types of adhesive failure. In this context, the book presents a detailed explanation of methods to predict, test and formulate adhesives and critically analyzes test results and traditionally accepted rules for adhesive formulation. The eBook version includes online access to a unique set of applied computer programs or "apps" that automate a wide range of adhesive formulas and enable readers to input their own data and numerically model adhesion properties in conjunction with, or prior to, chemical compounding and empirical testing. This volume constitutes a lucid and practical introduction to adhesion and adhesives appropriate for specialists at all levels.

Journal Of Experimental Biology

Author :
ISBN : NWU:35558005241290
Genre : Biology
File Size : 38. 63 MB
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Nordic Pulp And Paper Research Journal

Author :
ISBN : MINN:31951P00850738C
Genre : Paper industry
File Size : 25. 83 MB
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Author : Components, Packaging & Manufacturing Technology Society
ISBN : 0780389069
Genre : Electronic apparatus and appliances
File Size : 88. 85 MB
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Proceedings Of The World Tribology Congress Iii 2005

Author : American Society of Mechanical Engineers. Tribology Division
ISBN : 0791842010
Genre : Electronic books
File Size : 81. 73 MB
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Journal Of Pulp And Paper Science

Author :
ISBN : MINN:31951P010941627
Genre : Paper
File Size : 83. 66 MB
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American Book Publishing Record

Author :
ISBN : STANFORD:36105111051640
Genre : Books
File Size : 71. 89 MB
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