reliability and failure of electronic materials and devices

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Reliability And Failure Of Electronic Materials And Devices

Author : Milton Ohring
ISBN : 9780080575520
Genre : Technology & Engineering
File Size : 34. 30 MB
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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Corrosion And Reliability Of Electronic Materials And Devices

Author : Robert B. Comizzoli
ISBN : 1566772524
Genre : Technology & Engineering
File Size : 25. 91 MB
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Engineering Materials Science

Author : Milton Ohring
ISBN : 0080505694
Genre : Technology & Engineering
File Size : 53. 33 MB
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Milton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the fundamental background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design, processing materials into useful products, andhow material degrade and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing; mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability. The book offers superior coverage of electrical, optical, and magnetic materials than competing text. The author has taught introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has also written the well-received book, The Material Science of Thin Films (Academic Press). Key Features * Provides a modern treatment of materials exposing the interrelated themes of structure, properties, processing, and performance * Includes an interactive, computationally oriented, computer disk containing nine modules dealing with structure, phase diagrams, diffusion, and mechanical and electronic properties * Fundamentals are stressed * Of particular interest to students, researchers, and professionals in the field of electronic engineering

Materials Science Of Thin Films

Author : Milton Ohring
ISBN : 9780080491783
Genre : Technology & Engineering
File Size : 73. 7 MB
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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Electronic Materials Handbook

Author :
ISBN : 0871702851
Genre : Technology & Engineering
File Size : 41. 65 MB
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

P Diatrische Dermatologie

Author : Bernard A. Cohen
ISBN : 9783437592645
Genre : Medical
File Size : 70. 78 MB
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Mit diesem Lehrbuch und Atlas erhalten Sie sowohl ein Referenzwerk für den Einsatz in der Praxis als auch für die Ausbildung im Bereich der Pädiatrischen Dermatologie. Neu in der 2. Auflage: Über 800 hervorragende Abbildungen Orientiert an klinischen Fragestellungen Hilfreiche Texte zu Diagnose, Klinik und Therapie Algorithmen und Übersichtstabellen zur einfachen Differenzialdiagnose Sinnvolle Gliederung zum schnellen Nachschlagen

Materials Selection In Mechanical Design Das Original Mit Bersetzungshilfen

Author : Michael F. Ashby
ISBN : 3827417627
Genre : Technology & Engineering
File Size : 89. 58 MB
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Das englischsprachige, weltweit anerkannte Standardwerk zur Werkstoffauswahl - als neuer Buchtyp speziell für die Bedürfnisse deutschsprachiger Leser angepasst! Der Zusatznutzen, den dieses Buch bietet ist das Lesen und Lernen im englischen Original zu erleichtern und gleichzeitig in die spezielle Fachterminologie einzuführen und zwar durch: - Übersetzungshilfen in der Randspalte zur Fachterminologie und zu schwierigen normalsprachlichen Ausdrücken - Ein zweisprachiges Fachwörterbuch zum raschen Nachschlagen

Materials And Reliability Handbook For Semiconductor Optical And Electron Devices

Author : Osamu Ueda
ISBN : 9781461443360
Genre : Technology & Engineering
File Size : 58. 5 MB
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Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

Author : Ephraim Suhir
ISBN : 9780387329895
Genre : Technology & Engineering
File Size : 59. 11 MB
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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Failure Analysis

Author : Marius Bazu
ISBN : 1119990009
Genre : Technology & Engineering
File Size : 75. 77 MB
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Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

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