reliability of microtechnology interconnects devices and systems

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Reliability Of Microtechnology

Author : Johan Liu
ISBN : 144195760X
Genre : Technology & Engineering
File Size : 79. 12 MB
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Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.

Reliability Assessments

Author : Franklin Richard Nash, Ph.D.
ISBN : 9781315353845
Genre : Business & Economics
File Size : 73. 34 MB
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This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.

Safety And Reliability Methodology And Applications

Author : Tomasz Nowakowski
ISBN : 9781315736976
Genre : Technology & Engineering
File Size : 63. 30 MB
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Within the last fifty years the performance requirements for technical objects and systems were supplemented with: customer expectations (quality), abilities to prevent the loss of the object properties in operation time (reliability and maintainability), protection against the effects of undesirable events (safety and security) and the ability to restore performance (resilience). The need to adapt the operation of complex systems in such an uncertain and volatile environment has caused the necessity to formulate new and well established achievements associated with modeling, testing and evaluation of these properties. The concept of a complex system applies not only to the technical ones but also the infrastructure of major importance for social life such as transportation and logistics systems, buildings, power systems, water distribution systems or health services. Safety and Reliability: Methodology and Applications contains the proceedings of the 24th European Safety and Reliability Conference (ESREL 2014, Wroclaw, Poland, 14-18 September 2014), and discusses theories and methods and their applications in the areas of risk, safety and reliability. The abstracts book (408 pages) + full paper CD-ROM (2496 pages) will be of interest to researchers and practitioners, academics and engineers working in academic, industrial and governmental sectors.

Multicomponent And Multilayered Thin Films For Advanced Microtechnologies Techniques Fundamentals And Devices

Author : O. Auciello
ISBN : 0792322657
Genre : Technology & Engineering
File Size : 29. 7 MB
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Proceedings of the NATO Advanced Study Institute on Multicomponent and Multilayered Thin Films for Advanced Microtechnologies, Bad Windsheim, Germany, September 21-October 2, 1992

2001 International Semiconductor Conference

Author : IEEE
ISBN : 0780384997
Genre : Semiconductors
File Size : 58. 23 MB
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Nanoelectronic Device Applications Handbook

Author : James E. Morris
ISBN : 9781466565241
Genre : Technology & Engineering
File Size : 54. 94 MB
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Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal–oxide–semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe. The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include: Nanoscale advances in current MOSFET/CMOS technology Nano capacitors for applications such as electronics packaging and humidity sensors Single electron transistors and other electron tunneling devices Quantum cellular automata and nanomagnetic logic Memristors as switching devices and for memory Graphene preparation, properties, and devices Carbon nanotubes (CNTs), both single CNT and random network Other CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device fabrication and applications Nanowire transistors Nanodevices for spintronics The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.

Conductive Adhesives For Electronics Packaging

Author : Johan Liu
ISBN : 0901150371
Genre : Adhesive joints
File Size : 47. 77 MB
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Reliability Of Electronic Components

Author : Titu-Marius Bajenescu
ISBN : 9783642585050
Genre : Technology & Engineering
File Size : 54. 19 MB
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This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Technology Of Quantum Devices

Author : Manijeh Razeghi
ISBN : 1441910565
Genre : Technology & Engineering
File Size : 36. 38 MB
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Technology of Quantum Devices offers a multi-disciplinary overview of solid state physics, photonics and semiconductor growth and fabrication. Readers will find up-to-date coverage of compound semiconductors, crystal growth techniques, silicon and compound semiconductor device technology, in addition to intersubband and semiconductor lasers. Recent findings in quantum tunneling transport, quantum well intersubband photodetectors (QWIP) and quantum dot photodetectors (QWDIP) are described, along with a thorough set of sample problems.

Semiconductor International

Author :
ISBN : UCSD:31822022686588
Genre : Semiconductor industry
File Size : 23. 9 MB
Format : PDF
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