thermal and power management of integrated circuits integrated circuits and systems

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Thermal And Power Management Of Integrated Circuits

Author : Arman Vassighi
ISBN : 9780387297491
Genre : Technology & Engineering
File Size : 67. 36 MB
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In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Advances In 3d Integrated Circuits And Systems

Author : Yu Hao
ISBN : 9789814699037
Genre : Technology & Engineering
File Size : 76. 70 MB
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Design Of 3d Integrated Circuits And Systems

Author : Rohit Sharma
ISBN : 9781351831598
Genre : Technology & Engineering
File Size : 22. 89 MB
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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Power Management Integrated Circuits

Author : Mona M. Hella
ISBN : 9781482228946
Genre : Technology & Engineering
File Size : 23. 76 MB
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Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Heat Management In Integrated Circuits

Author : Seda Ogrenci-Memik
ISBN : 9781849199346
Genre : Computers
File Size : 39. 71 MB
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Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Distributed Computing In Sensor Systems

Author : Rajmohan Rajaraman
ISBN : 9783642136511
Genre : Computers
File Size : 53. 85 MB
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The book constitutes the refereed proceedings of the 6th International Conference on Distributed Computing in Sensor Systems, DCOSS 2010, held in Santa Barbara, CA, USA, in June 2010. The 28 revised full papers presented were carefully reviewed and selected from 76 submissions. The research contributions in this proceedings span important aspects of sensor systems, including energy management; communication; coverage and tracking; time synchronization and scheduling; key establishment and authentication; compression; medium access control; code update; and mobility.

Three Dimensional Integrated Circuit Design

Author : Vasilis F. Pavlidis
ISBN : 9780124104846
Genre : Technology & Engineering
File Size : 76. 88 MB
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three Dimensional Integrated Circuit Design

Author : Yuan Xie
ISBN : 144190784X
Genre : Technology & Engineering
File Size : 21. 73 MB
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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Micai 2008 Advances In Artificial Intelligence

Author : Alexander Gelbukh
ISBN : 9783540886358
Genre : Computers
File Size : 42. 29 MB
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The Mexican International Conference on Artificial Intelligence (MICAI), a yearly international conference series organized by the Mexican Society for Artificial Intel- gence (SMIA), is a major international AI forum and the main event in the academic life of the country’s growing AI community. In 2008 Mexico celebrates the 50th an- versary of development of computer science in the country: in 1958 the first computer was installed at the National Autonomous University of Mexico (UNAM). Nowadays, computer science is the country’s fastest growing research area. The proceedings of the previous MICAI events were published by Springer in its Lecture Notes in Artificial Intelligence (LNAI) series, vol. 1793, 2313, 2972, 3789, 4293, and 4827. Since its foundation in 2000, the conference has been growing in popularity, and improving in quality. This volume contains the papers presented at the oral session of the 7th Mexican International Conference on Artificial Intelligence, MICAI 2008, held October 27–31, 2008, in Atizapán de Zaragoza, Mexico. The conference received for evaluation 363 submissions by 1,032 authors from 43 countries (see Tables 1 and 2). This volume contains revised versions of 94 papers by 308 authors from 28 countries selected - cording to the results of an international reviewing process. Thus the acceptance rate was 25.9%. The book is structured into 20 thematic fields representative of the main current areas of interest for the AI community, plus a section of invited papers:

Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation

Author : Jose L. Ayala
ISBN : 9783642241536
Genre : Computers
File Size : 64. 29 MB
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This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.

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