thermal and power management of integrated circuits integrated circuits and systems

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Thermal And Power Management Of Integrated Circuits

Author : Arman Vassighi
ISBN : 9780387297491
Genre : Technology & Engineering
File Size : 48. 71 MB
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In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Capacity Oriented Analysis And Design Of Production Systems

Author : M. B. M. de Koster
ISBN : STANFORD:36105032455730
Genre : Business & Economics
File Size : 73. 48 MB
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Heat Management In Integrated Circuits

Author : Seda Ogrenci-Memik
ISBN : 9781849199346
Genre : Computers
File Size : 31. 67 MB
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Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Advances In 3d Integrated Circuits And Systems

Author : Yu Hao
ISBN : 9789814699037
Genre : Technology & Engineering
File Size : 46. 30 MB
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Design Of 3d Integrated Circuits And Systems

Author : Rohit Sharma
ISBN : 9781351831598
Genre : Technology & Engineering
File Size : 76. 42 MB
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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Three Dimensional Integrated Circuit Design

Author : Vasilis F. Pavlidis
ISBN : 9780124104846
Genre : Technology & Engineering
File Size : 36. 21 MB
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation

Author : Vassilis Paliouras
ISBN : 9783540290131
Genre : Computers
File Size : 83. 97 MB
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This book constitutes the refereed proceedings of the 15th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2005, held in Leuven, Belgium in September 2005. The 74 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-power processors, code optimization for low-power, high-level design, telecommunications and signal processing, low-power circuits, system-on-chip design, busses and interconnections, modeling, design automation, low-power techniques, memory and register files, applications, digital circuits, and analog and physical design.

Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation

Author : Jose L. Ayala
ISBN : 9783642241536
Genre : Computers
File Size : 28. 78 MB
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This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.

Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation

Author : Johan Vounckx
ISBN : 9783540390947
Genre : Computers
File Size : 38. 31 MB
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This book constitutes the refereed proceedings of the 16th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2006, held in Montpellier, France, in September 2006. The 41 revised full papers and 23 revised poster papers presented together with 4 key notes and 3 industrial abstracts were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on high-level design, power estimation and modeling memory and register files, low-power digital circuits, busses and interconnects, low-power techniques, applications and SoC design, modeling, digital circuits, and reconfigurable and probrammable devices.

Power Management Techniques For Integrated Circuit Design

Author : Ke-Horng Chen
ISBN : 9781118896822
Genre : Technology & Engineering
File Size : 57. 63 MB
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This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads

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